Intel has announced that its next-generation 45nm microprocessors will be produced using 100 percent lead-free technology. Although Intel has taken steps in the past to eliminate the use of lead from most of its product line, lead solder interconnects were still used in CPU packaging. Moving forward, Intel will use a tin/silver/copper alloy instead, though the exact ratios of each metal are unknown (Intel refers to this as its "secret sauce.")
Eliminating the last of the lead in its CPU manufacturing process will improve Intel's overall "green" status, as have other steps the manufacturer has taken. These steps include cutting the amount of water used to manufacture products, recycling more of its hazardous waste, and evaluation of halogen-free products and technologies. Although all of these are positive steps, they won't solve the serious and ever-growing problem of what happens when computer equipment is thrown out.
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