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VIA and SiS to launch a series of high-end chipsets in March | |
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| Time: 22:48 EST/03:48 GMT | News Source: ActiveWin.com | Posted By: Guillaume Hébert | ||
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The second round of the chipset competition will soon begin in March with designers such as VIA Technologies and Silicon Integrated Systems (SiS) launching more high-end products, of which many will be showcased at the CeBIT show in Germany. Hoping to gain the lead in the market, chipset companies are picking up a specification battle that is demanding higher specifications in memory architecture, north bridge FSB (front-side bus) speed and peripheral interfaces on the south bridge. Besides the advanced DDR333 and DDR400 architectures and AGP 8x mode, many chipsets also support a 533MHz FSB to support Intel’s new-generation Pentium 4 processors. | ||
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