| ActiveMac | Anonymous | Create a User | Reviews | News | Forums | Advertise |
|
|
|
User Controls |
|
New User |
|
Login |
|
Edit/View My Profile |
|
|
|
|
|
|
|
ActiveMac |
|
Articles |
|
Forums |
|
Links |
|
News |
|
News Search |
|
Reviews |
|
|
|
|
|
|
|
News Centers |
|
Windows/Microsoft |
|
DVD |
|
ActiveHardware |
|
Xbox |
|
MaINTosh |
|
News Search |
|
|
|
|
|
|
|
ANet Chats |
|
The Lobby |
|
Special Events Room |
|
Developer's Lounge |
|
XBox Chat |
|
|
|
|
|
|
|
FAQ's |
|
Windows 98/98 SE |
|
Windows 2000 |
|
Windows Me |
|
Windows "Whistler" XP |
|
Windows CE |
|
Internet Explorer 6 |
|
Internet Explorer 5 |
|
Xbox |
|
DirectX |
|
DVD's |
|
|
|
|
|
|
|
TopTechTips |
|
Registry Tips |
|
Windows 95/98 |
|
Windows 2000 |
|
Internet Explorer 4 |
|
Internet Explorer 5 |
|
Windows NT Tips |
|
Program Tips |
|
Easter Eggs |
|
Hardware |
|
DVD |
|
|
|
|
|
|
|
Latest Reviews |
|
Applications |
|
Microsoft Windows XP Professional |
|
Norton SystemWorks 2002 |
|
|
|
Hardware |
|
Intel Personal Audio Player 3000 |
|
Microsoft Wireless IntelliMouse Explorer |
|
|
|
|
|
|
|
Site News/Info |
|
About This Site |
|
Affiliates |
|
ANet Forums |
|
Contact Us |
|
Default Home Page |
|
Link To Us |
|
Links |
|
Member Pages |
|
Site Search |
|
Awards |
|
|
|
|
|
|
|
Credits |
 |
Intel Researchers Disclose Packaging Technology Breakthrough To Enable Billion-Transistor Processors | |
|
||
| Time: 13:26 EST/18:26 GMT | News Source: Press Release | Posted By: Julien Jay | ||
Intel Corporation today announced its researchers have developed a new semiconductor packaging technology that will help the company build processors with more than 1 billion transistors that will be 10 times faster than the fastest processors today. The technology, called "Bumpless Build-Up Layer" or BBUL packaging, takes a completely different approach to packaging from the current practice of manufacturing the processor die separately and later bonding it to the package. Instead, BBUL "grows" the package around the silicon, resulting in thinner, higher-performance processors that consume less power. Intel believes it can begin making BBUL packaging available for commercial products in the next five to six years. | ||
|
Write Comment
Return to News |
Displaying 401 through 425 of 730 Prev | First | Last | Next |
The time now is
5:12:18 PM
ET.
Any comment problems? E-mail us |
|
Write Comment
Return to News |
Displaying 401 through 425 of 730 Prev | First | Last | Next |
The time now is
5:12:18 PM
ET.
Any comment problems? E-mail us |
