Samsung Electronics and Mitsubishi Electric have agreed to jointly develop camera chips for use in mobile phones, personal organizers and mobile PCs, reported the Electronics Times of South Korea.
Under the agreement, Samsung will be responsible for designing and manufacturing a CMOS image sensor (CIS) and Mitsubishi will produce a complementary image signal processor (ISP) chip. The two companies will share engineering information, technical support and marketing of co-developed camera module solutions for portable devices.
|