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Marvell to launch 802.11b chip solutions integrating WLAN and 3G technology | |
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| Time: 23:40 EST/04:40 GMT | News Source: DigiTimes | Posted By: Guillaume Hbert | ||
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Joining rivals Philips and Broadcom in their push into wireless chips, US-based Marvell Semiconductor is developing a new generation of chips that integrate WLAN and third-generation (3G) mobile phone connectivity, confirmed Gary Szilagyi, vice president of worldwide sales for the companys Communications Business Group. However, he declined to disclose details on the timetable for development. Marvells switch chip products and mixed signal processor technology have helped it seize a niche among semiconductor suppliers, but now hopes to tap the wireless market. To meet demand for WLAN products, in May Marvell will launch 802.11b chipset solutions using a baseband chip and RF (radio frequency) transceiver. The transceiver will integrate a PA (power amplifier). The company also expects to roll out another WLAN solution including a chip that integrates an MAC (media-access controller) and baseband chip and an integrated RF/PA chip, both in the third quarter. | ||
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