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New heat dissipation methods unveiled by Intel | |
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| Time: 14:09 EST/19:09 GMT | News Source: EBN | Posted By: Guillaume Hébert | ||
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Intel Corp. has developed a new heat sink and fan to dissipate more than 50% more heat from more powerful processors, the Intel Developers Forum was told this week. Louis Burns, vice president and co-general manager of the Intel Desktop Platforms group, said the firm will work with external vendors, as it traditionally does, to bring the radically new heat sink and fan to market. He told EBN that the new devices will dissipate 83 watts, compared with 52 watts for a 2-GHz Pentium 4 or 55 watts for a 2.2-Ghz P4 with existing heat sink and fans. The much higher heat dissipating devices are aimed at the growing smaller desktop PC form factor market. Burns said it is not intended for the mobile or server markets, which have their own specialized heat sinks and fans. | ||
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